3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

af Lih-Tyng Hwang

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab * Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained... (Læs mere)