3D Integration in VLSI Circuits
Implementation Technologies and Applications
Bog, Paperback, Engelsk, 2021
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
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Bogdetaljer
- SprogEngelsk
- IndbindingPaperback
- ISBN9781032095547
- Udgivet30/06/2021
- Udgivet afTaylor & Francis Ltd
- Længde234 sider
- GenreBusiness og læring