Billede af bogens forside - 3D Integration in VLSI Circuits

3D Integration in VLSI Circuits

Implementation Technologies and Applications

Bog, Paperback, Engelsk, 2021

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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Bogdetaljer

  • SprogEngelsk
  • IndbindingPaperback
  • ISBN9781032095547
  • Udgivet30/06/2021
  • Udgivet afTaylor & Francis Ltd
  • Længde234 sider
  • GenreBusiness og læring